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Heat treatment is commonly used during device processing in order to achieve specific functionalities of the devices. How a series of heat treatment applies to accomplish this goal can be found in the literature. However, specific properties of the devices after the treatment are more emphasized than the details of the structural modifications in the industrial applications. In this paper, it is intended to illustrate the fundamental changes in the structure due to heat treatment which resultdoi:10.1155/2011/987671 fatcat:ig3xrpk7ojhgjd5rxxouflpdlq