Internet Archive Scholar

Interactions between liquid Sn-Bi based solders and contact metals for high temperature applications

J.F. Li, S.H. Mannan, M.P. Clode, H.M. Lobato, C. Liu, D.C. Whalley, F.T. Lawrence, G. Jackson, H. Steen
Proceedings Electronic Components and Technology, 2005. ECTC '05.  

Preserved Fulltext

fulltext thumbnail
Web Archive Capture PDF (596.0 kB)
https://web.archive.org/web/20190318211135/https://core.ac.uk/download/pdf/2740241.pdf

A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2019; you can also visit the original URL. The file type is application/pdf.

Citation: LI, J.F....et al., 2005. Interactions between liquid Sn-Bi based solders and contact metals for high temperature applications.
doi:10.1109/ectc.2005.1441302 fatcat:qeiuqzuzwvbhrkgsbqyd3pbzv4
Citation

J.F. Li, S.H. Mannan, M.P. Clode, H.M. Lobato, C. Liu, D.C. Whalley, F.T. Lawrence, G. Jackson, H. Steen. "Interactions between liquid Sn-Bi based solders and contact metals for high temperature applications." Proceedings Electronic Components and Technology, 2005. ECTC '05.