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Applications fo polyimides in microelectronics were reviewed. Only materials that can retain sufficient reliability for severe heat conditions(180-400°C) can be used as insulation materials for electronics. Polyimides are an invaluable organic materials that satisfy the heat resistance requirement. For polyimides, fine patterning technologies of below 1 micron have been established. These technologies are sufficient for wiring board applications and passable for LSI wiring. Dielectrics with lowdoi:10.2494/photopolymer.14.29 fatcat:prqdlzzdbvagncpkm2l22nt2cy