Polyimides in Microelectronics Applications

Takao Miwa
2001 Journal of Photopolymer Science and Technology (Fotoporima Konwakai shi)  
Applications fo polyimides in microelectronics were reviewed. Only materials that can retain sufficient reliability for severe heat conditions(180-400°C) can be used as insulation materials for electronics. Polyimides are an invaluable organic materials that satisfy the heat resistance requirement. For polyimides, fine patterning technologies of below 1 micron have been established. These technologies are sufficient for wiring board applications and passable for LSI wiring. Dielectrics with low
more » ... k become necessary for high performance electronic products Table 1 lists k for various inorganic materials and organic polymers. Except for Teflon and polyethylene, polyimides give the lowest k. A large number of monomers with a variety of structures offer wide possibilities for molecular design of polyimides. Now-a-days, corresponding to strong demands for better electrical consumer products, many kinds of applications are spreading widely; e.g. LSI buffer coat films, TAB tapes, adhesives for LSI packaging, liquid crystal orientation films, and optical application fields such as waveguides. Polyimides will be more important material in electronics, because of their superior properties coupled with wide design tolerance.
doi:10.2494/photopolymer.14.29 fatcat:prqdlzzdbvagncpkm2l22nt2cy