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Phenol formaldehyde (PF) is thermosetting polymer that is widely used in many applications, including as an adhesive in wood industry.Modification using sodium silicate has been successfully improving the curing temperature and bonding strength. But, it's important to studies phenol formaldehyde thermal stability, since its main application were using high temperature. In this work, the thermal stability of modified phenol formaldehyde was studied using thermogravimetric analysis (TG/DTA) atfatcat:f7rsytwgbndufkfqusu63dg4yu