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Integrated Micromechanical Circuits for RF Front Ends
Proceedings of the European Solid-State Circuits Conference, IEEE
Having now produced devices with sufficient Q, thermal stability, aging stability, and manufacturability, vibrating RF MEMS technology is already finding its way into next generation timing and wireless applications. At this juncture, the technology is now poised to take its next logical steps: higher levels of circuit complexity and integration. In particular, as vibrating RF MEMS devices are perceived more as circuit building blocks than as stand-alone devices, and as the frequency processingdoi:10.1109/essder.2006.307630 fatcat:gx7it367ave6jg57bj2t6yypje