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Computational stress analysis was performed in this study to investigate the solder joint reliability of plastic ball grid array (PBGA) packages with various configurations. The packages under investigation were 27 mm body-size, 1.27 mm ball-pitch, perimeter PBGAs with and without thermal balls at the centre. The diagonal cross-section of the PBGA-printed circuit board (PCB) assembly was modelled by plane-strain elements. The model was subjected to a uniform thermal loading and the solderdoi:10.1108/03056129710370132 fatcat:464rph67s5b7zgq43qpx3qeexu