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Thermal Design and Cooling Performance Evaluation of Electronic Equipment Containing Power Electronic Devices
International Journal of Heat and Technology
In electronic equipment, thermal failure and thermal degradation are two increasingly prominent problems of the devices, with the deepening integration and growing power density. Currently, there are relatively few reports on the heat transfer mechanism, heat source analysis, and numerical simulation of electronic equipment containing power electronic devices (PEDs). Therefore, this paper carries out thermal design and evaluates the cooling performance of PED-containing electronic equipment.doi:10.18280/ijht.390214 fatcat:icmtg6w4bveyll2vatqoht3mzq