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Inductively Coupled Connectors and Sockets for Multi-Gb/s Pulse Signaling
2008
IEEE Transactions on Advanced Packaging
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Multi-Gb/s pulse signaling is demonstrated with inductively coupled interconnects across packaging interfaces. This has application in realizing submillimeter pitch, true zero insertion force (ZIF) surface mount connectors, and sockets. The signaling data rate achieved in this system is from 1 to 8.5 Gbps, which depends on the 3-dB coupling frequency of the composite channel consisting of the inductive interconnections and the transmission lines. This paper presents the results of a set of
doi:10.1109/tadvp.2008.2005465
fatcat:gttwxxkbrfbifbbwt56a5mi5ny