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The Effect of Additional Elements on the Interfacial Structure and Strength at the Solder Joint between Sn-Ag-X Solder and Electroless Ni-P Plating
QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
The joint strength and the joint interfaces between electroless Ni-P plating and Sn-Ag solders ,as replacement solders for the eutectic Sn-37 Pb, were investigated. The joint strength between Cu plated by electroless Ni-P and Sn-3.5 Ag and Sn-3.5 Ag-(8, 9, 10) In decreased after annealing at 373 K, 398 K and 423 K. The effect of Zn addition to Sn-3.5 Ag and Sn-3.5 Ag-8 In on the joint strength and thickness of reaction layers was investigated. The joint strength of as-joined interfaces betweendoi:10.2207/qjjws.21.116 fatcat:f64qwnoel5hkrjon5ax4z43xvq