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Research on the Production Scheduling Method of a Semiconductor Packaging Test Based With the Clustering Method
2019
International Journal of Information Systems and Supply Chain Management (IJISSCM)
In this article, the scheduling of modern industrial production is studied. The research on scheduling of semiconductor packaging and testing is put forward. A new solution of packaging and test scheduling based on dynamic optimization is proposed. The decomposition strategy is used to solve the problem of the encapsulation test scheduling problem. The complexity of the problem is reduced to ensure the consistency of optimization. In the method, an AP clustering algorithm is used to optimize
doi:10.4018/ijisscm.2019040103
fatcat:cewy2woz45gutbvgmreaskjyee