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Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)
This paper presents the first implementation of batch-transferred microrelays for a broad range of RF applications and substrates. The transferred relays include a variety of electrostatic pull-down type structures, as well as see-saw type structures. The batch-transfer methodology allows integration of optimized MEMS in RF systems on substrates such as sapphire, GaAs, and even CMOS. Gold-togold contact series microrelays with insertion loss of <0.15 dB, and isolation better than 36 dB atdoi:10.1109/memsys.2000.838618 fatcat:dvjzutpqzbgdde7ypvygrlifwq