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Micromachined power sensors with operation up to 50 GHz were recently achieved in CMOS technology . To improve their sensitivity and signal-to-noise ratio, while maintaining microwave performance, several design parameters must be considered, such as the number and placement of thermocouples. This paper presents experimental and analytical thermal characterization of the sensors, which provides insight into the proper adjustment of the layout parameters. Experimental results were obtained bydoi:10.1109/iscas.1999.777531 dblp:conf/iscas/MilanovicHZGZ99 fatcat:bsnpf2xzknfhxd2vl5offfvs2e