To enhance the per node throughput, mesh nodes in wireless mesh networks can be equipped with multiple network interfaces (NIC). In this paper, we propose a new multi-interface equipped architecture, named "Wireless Bonding (WBond)", which enables each node to fully utilize all its available interfaces, resulting in increased throughput. The proposed WBond provides a method for exposing a single virtual interface by bonding multiple NICs. When a node needs to transfer a packet, WBond selects

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... among the multiple interfaces depending upon the channel quality assigned to each interface. A novel method for measuring channel quality, called as "ChanQual", is presented and used by the WBond with high accuracy and no additional overhead. Comparison studies using ns-2 simulations show that our WBond scheme can achieve the most reliable and highest performance (i.e., network throughput) compared to traditional multi-interface architectures. Keywords-wireless mesh networks; multi-interface bonding I.