Wireless Bonding for Maximizing Throughput in Multi-Radio Mesh Networks

Sung-Ho Kim, Young-Bae Ko
2007 Fifth Annual IEEE International Conference on Pervasive Computing and Communications Workshops (PerComW'07)  
To enhance the per node throughput, mesh nodes in wireless mesh networks can be equipped with multiple network interfaces (NIC). In this paper, we propose a new multi-interface equipped architecture, named "Wireless Bonding (WBond)", which enables each node to fully utilize all its available interfaces, resulting in increased throughput. The proposed WBond provides a method for exposing a single virtual interface by bonding multiple NICs. When a node needs to transfer a packet, WBond selects
more » ... among the multiple interfaces depending upon the channel quality assigned to each interface. A novel method for measuring channel quality, called as "ChanQual", is presented and used by the WBond with high accuracy and no additional overhead. Comparison studies using ns-2 simulations show that our WBond scheme can achieve the most reliable and highest performance (i.e., network throughput) compared to traditional multi-interface architectures. Keywords-wireless mesh networks; multi-interface bonding I.
doi:10.1109/percomw.2007.126 dblp:conf/percom/KimK07 fatcat:6jxv2gzxenhsdoygqz3t4mkwnm