Program CICC, flow and heat transfer in cable in conduit conductors
IEEE Thirteenth Symposium on Fusion Engineering
DISCLAIMER This docaiaent wis prepared as ** acceoar ef work spoasare*' by aa ageacy «f the failed Sates GoTeraaicat. Neither lae United States Go'enawat aor the Ualtersitf of CaUforaia aor aay of their employees, aukes aay warraaty, express « iaplkd, w assumes any legal llaWllty or resaoasibitity far the accaracy. cataakteaoa, or atefalness of any iaformalioa, apparatus, prodact, or process disclosed, or represeats that its as* woald not iafriage privately owaed rights. Refereace hereia to any
... reace hereia to any snedfk commercial products, process, or senfce by trade naaw, trade aw*, aauufactarer, or otherwise, does not aecessarily cottstitate or haply its eadorseateat, recoaiwtendaUon, or faroriag by the United States Gomaiaeat or the Uaitmity of Califoraia. The views aad opiaioas or authors expressed herein do aot aeceuarily sUte or reflect those of thr United SUtes Govenuacat or the Uaiversily of California, and shall sot he used for ad*ertis!ag. or prodact eadorseraeat •waxes. Abstract Computer program CICC has been written for use in the thermo-fluids design of superconducting magnets for tokamak reactors, which use forced-flow, helium-cooled, cable-in-conduit conductors (CICC). In addition to background heat loads that vary with space and time, these superconductors can develop normal zones that generate electrical resistance heat. Program CICC models the transient thermodynamic and fluid-dynamic system response to background heating and normal-zone propagation in the superconductor. The computational algorithm described in this paper couples a onedimensional, compressible pipe-flow model (including flow choking) with two-dimensional, axisymmetric hez-tconduction models of the superconductor cable, the conduit, and the epoxy-conduit insulation. National Institute of Standards and Technology helium properties are used. The model is verified by comparison with measured temperature and pressure profiles from thermal expulsion experiments.