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With the progress of deep submicron technology power consumption and temperature related issues have become dominant factors for chip design. Therefore, very large-scale integrated systems like Systems-on-Chip (SoCs) are exposed to an increasing thermal stress. On the one hand, this necessitates effective mechanisms for thermal management. On the other hand, appliance of thermal management is accompanied by disturbance of system integrity and degradation of system performance. In this paper wedoi:10.1109/issoc.2011.6089219 dblp:conf/issoc/WegnerGT11 fatcat:dpfjp5tumbe7popgdiivq4rdbm