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30th European Microwave Conference, 2000
This paper describes the design and the fabrication of a new type of millimeter-wave micromachined band pass filters, using silicon waveguides. The main interest of these components is their ability to be integrated along with other MMICs using flip chip bonding techniques. The micromachining fabrication technique allows to maintain very good fabrication tolerances, while the resulting filters are very compact. The design methodology is presented along with two examples of two and four poledoi:10.1109/euma.2000.338709 fatcat:jdtqdzsnk5gmffwjhge6ukmfoe