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WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Array
2022
Electronics
The performance of WR-3.4 overmoded waveguide modules containing a linear array of discrete terahertz integrated circuits is presented to verify a new power-combining technique. Custom-designed thru-line IC chips that include back-to-back broadband antenna transitions were fabricated with an area of 390 × 750 mm2 for waveguide packaging. Multiple array modules were assembled to verify the repeatability in performance. The array modules exhibited almost identical amounts of insertion losses
doi:10.3390/electronics11132091
fatcat:uu45ygsmb5adfa7rmxdj23wdo4