Mechanical Properties of Micro- and Nanostructured Copper Films

N. Kosarev, M. Khazin, R. Apakashev, N. Valiev
2013 Journal of Materials Science and Chemical Engineering  
Mechanical properties of electrodeposited and electroless copper with nano-and crystalline structure are considered. Grain diameters in films ranged from 0.06 to 8 μm. A model is described which takes into account the grain boundary hardening and density of dislocation.
doi:10.4236/msce.2013.15002 fatcat:b4zm3inz55cjxan2snuqfvhzvq