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Mechanical Properties of Micro- and Nanostructured Copper Films
2013
Journal of Materials Science and Chemical Engineering
Preserved Fulltext
Mechanical properties of electrodeposited and electroless copper with nano-and crystalline structure are considered. Grain diameters in films ranged from 0.06 to 8 μm. A model is described which takes into account the grain boundary hardening and density of dislocation.
doi:10.4236/msce.2013.15002
fatcat:b4zm3inz55cjxan2snuqfvhzvq