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International Journal of Modern Trends in Engineering & Research
This paper presents the design and simulation of a microstrip patch antenna (MPA) which is modeled by placing several rectangular copper layer with conductive characteristics on a substrate material with dielectric constant 3.0 and 22x18x1 mm 3 geometry. This microstrip path was designed with copper material which had a very thin thickness for patch and ground. In this study, a change in resonance frequency and return loss characteristics were observed for several substrate thickness values.doi:10.21884/ijmter.2016.3119.vu754 fatcat:dqp5fbbz2nfurc5qwwlqeifpae