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In this paper, we investigate a new architecture-level thermal characterization problem from behavioral modeling perspective to address the emerging thermal related analysis and optimization problems for high-performance multi-core microprocessor design. We propose a new approach, called ThermPOF, to build the thermal behavioral models from the measured architecture thermal and power information. ThermPOF first builds the behavioral thermal model using generalized pencil-of-function (GPOF)doi:10.1109/aspdac.2008.4483994 dblp:conf/aspdac/LiTT08 fatcat:x5z4zedcdfhixhhjaozcpljtvy