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Triple patterning aware detailed placement toward zero cross-row middle-of-line conflict
2015
2015 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)
Triple patterning lithography (TPL) is one of the most promising lithography technology in sub-14nm technology nodes, especially for complicated low metal layer manufacturing. To overcome the intra-cell routability problem and improve the cell regularity, recently middle-of-line (MOL) layers are employed in standard cell design. However, MOL layers may introduce a large amount of cross-row TPL conflicts for row based design. Motivated by this challenge, in this paper we propose the first TPL
doi:10.1109/iccad.2015.7372597
dblp:conf/iccad/LinYXP15
fatcat:btm4muki6rcbnjdibqea4qh6wi