Electrophoretic Deposition of Pb(Zr, Ti)O3 Powder on Si Wafer: Morphological Change Across Film Thickness

Ni KANG, Jing-Feng LI
2006 Journal of the Ceramic Society of Japan  
Note péÉÅá~ä fëëìÉ Äó dìÉëí bÇáíçêëW kçîÉä j~íÉêá~äë aÉëáÖå~åÇ mêçÅÉëëáåÖ Äó bñíÉêå~ä åÇ fåíÉêå~ä oÉ~Åíáçå cáÉäÇë bäÉÅíêçéÜçêÉíáÅ aÉéçëáíáçå çÑ mÄwê, qál P mçïÇÉê çå pá t~ÑÉêW jçêéÜçäçÖáÅ~ä'Ü~åÖÉ^Åêçëë cáäã qÜáÅâåÉëë PZT thick films were prepared using electrophoretic deposition EPD process with special emphasis placed on the powder packing behavior on silicon substrates. The suspending medium used was an ethanol solution containing an appropriate amount of HCl to introduce surface charges to
more » ... e PbZr, TiO 3 particles, which were deposited on PtTiSiO 2 Si substrates under a constant electrical field. It was found that the deposited microstructure gradually changed across the film thickness: large particles were initially deposited, followed by the deposition of small particles. Such a phenomenon was explained by using the Derjauin-Landau-Verwey-Overbeek DLVO theory which considers a particle size effect on the surface charge responsible for the EPD process.
doi:10.2109/jcersj.114.128 fatcat:kj5xaz2bczbyrjticdmavyzb7q