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Signal Transmission Analysis of Burn-In Socket for Fine-Pitch Ball Grid Array Package
2014
International Journal of Control and Automation
Signal transmission analysis is investigated for a burn-in socket of fine-pitch ball grid array (FBGA) package using a three-dimensional electromagnetic field simulation. The effects of different signal-ground pin assignments on its signal transmission characteristics are analyzed in this work. Also, its electric and magnetic fields are presented to evaluated their distribution intensity around the signal and ground pins. Its reflection and insertion losses are calculated to analyze the effects
doi:10.14257/ijca.2014.7.7.39
fatcat:o7fbc7mvmzhldkalqpgps6dlnm