A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2018; you can also visit the original URL.
The file type is application/pdf
.
Mathematical Modeling of Transient Heat Conduction and Analysis of Thermal Stresses in a Thin Circular Plate
2011
Progress in Applied Mathematics
unpublished
In this paper, the solution of the problem of transient heat conduction in a thin circular plate subjected to two types of boundary conditions is obtained by employing the integral transform technique in the form of infinite series. It is assumed that the plate is in the plane state of stress and initially the temperature of the plate is kept at zero. The first type of boundary condition is that in which the upper surface is kept at arbitrary temperature, lower surface is kept at zero
fatcat:rnv5i5zuyjae7m7zmdfsrlnu4e