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Wafer-scale fabrication of nanoapertures using corner lithography
Several submicron probe technologies require the use of apertures to serve as electrical, optical or fluidic probes; for example, writing precisely using an atomic force microscope or near-field sensing of light reflecting from a biological surface. Controlling the size of such apertures below 100 nm is a challenge in fabrication. One way to accomplish this scale is to use high resolution tools such as deep UV or e-beam. However, these tools are wafer-scale and expensive, or only provide seriesdoi:10.1088/0957-4484/24/28/285303 pmid:23792365 fatcat:rowqzjee2fepplzwtkcwog36mu