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The reason behind the majority of difficulties encountered in the integration of nanoscale objects with microelectromechanical systems can almost always be traced back to the lack of batch-compatible fabrication techniques at the nanoscale. On the one hand, self-assembly products do not allow a high level of control on their orientation and numbers, and hence, their attachment to a micro device is problematic. On the other hand, top-down approaches, such as e-beam lithography, are far fromdoi:10.1088/0957-4484/17/9/026 fatcat:wi6p3oy44nbntjqvbv4ufsql7m