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2021 Research, Invention, and Innovation Congress: Innovation Electricals and Electronics (RI2C)
This paper presents, a novel design of a Hollow Substrate Integrated Waveguide (HSIW), that is built by using both Subtractive and Additive Manufacturing technologies. Specifically, it utilizes Polymer jetting method to print an Acrylonitrile butadiene styrene (ABS) dielectric substrate and a water laser cutter system to produce smooth copper sheets as the top and bottom enclosures of the HSIW. Also, the fabrication process is utilizing mechanical through hole plating of commercially availabledoi:10.1109/ri2c51727.2021.9559806 fatcat:ubrbmy6nbnbkfo4ipl2usazdiy