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Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7Cu-0.05Ni
2018
Intermetallics (Barking)
The influence of Ni on the size and twinning of primary Cu6Sn5 crystals in Sn-0.7Cu-0.05Ni and Sn-xCu (x=0.7, 0.9, 1.1) (mass%) solder joints is studied using synchrotron radiography and SEM-based EBSD. It is shown that the Ni addition does not cause significant refinement of primary Cu6Sn5 if the alloy is fully melted. However, for peak temperatures ≤ 250°C relevant to industrial soldering, primary Cu6Sn5 are not completely melted in Sn-0.7Cu-0.05Ni and there are 10-100 times more numerous and
doi:10.1016/j.intermet.2018.08.002
fatcat:un6fi6a6jzcslkg32nlu6fsffy