RF/wireless interconnect for inter- and intra-chip communications

M.F. Chang, V.P. Roychowdhury, Liyang Zhang, Hyunchol Shin, Yongxi Qian
2001 Proceedings of the IEEE  
Recent studies showed that conventional approaches being used to solve problems imposed by hard-wired metal interconnects will eventually encounter fundamental limits and may impede the advance of future ultralarge-scale integrated circuits (ULSIs). To surpass these fundamental limits, we introduce a novel RF/wireless interconnect concept for future inter-and intra-ULSI communications. Unlike the traditional "passive" metal interconnect, the "active" RF/wireless interconnect is based on low
more » ... and dispersion-free microwave signal transmission, near-field capacitive coupling, and modern multiple-access algorithms. In this paper, we address issues relevant to the signal channeling of the RF/wireless interconnect and discuss its advantages in speed, signal integrity, and channel reconfiguration. The electronic overhead required in the RF/wireless-interconnect system and its compatibility with the future ULSI and MCM (multi-chip-module) will be discussed as well.
doi:10.1109/5.920578 fatcat:p2ig5gk4cvbercql4iyaly5eju