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RF/wireless interconnect for inter- and intra-chip communications
<span title="">2001</span>
<i title="Institute of Electrical and Electronics Engineers (IEEE)">
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Recent studies showed that conventional approaches being used to solve problems imposed by hard-wired metal interconnects will eventually encounter fundamental limits and may impede the advance of future ultralarge-scale integrated circuits (ULSIs). To surpass these fundamental limits, we introduce a novel RF/wireless interconnect concept for future inter-and intra-ULSI communications. Unlike the traditional "passive" metal interconnect, the "active" RF/wireless interconnect is based on low
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... and dispersion-free microwave signal transmission, near-field capacitive coupling, and modern multiple-access algorithms. In this paper, we address issues relevant to the signal channeling of the RF/wireless interconnect and discuss its advantages in speed, signal integrity, and channel reconfiguration. The electronic overhead required in the RF/wireless-interconnect system and its compatibility with the future ULSI and MCM (multi-chip-module) will be discussed as well.
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