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RF/wireless interconnect for inter- and intra-chip communications
Proceedings of the IEEE
Recent studies showed that conventional approaches being used to solve problems imposed by hard-wired metal interconnects will eventually encounter fundamental limits and may impede the advance of future ultralarge-scale integrated circuits (ULSIs). To surpass these fundamental limits, we introduce a novel RF/wireless interconnect concept for future inter-and intra-ULSI communications. Unlike the traditional "passive" metal interconnect, the "active" RF/wireless interconnect is based on lowdoi:10.1109/5.920578 fatcat:p2ig5gk4cvbercql4iyaly5eju