In the present work, we have studied the thermal exchanges of different geometry sections of mini-channels of a cooler numerically. Particularly, we have chosen a mini channels cooler copper for cooling an electronic chip IGBT. In our simulation of three-dimensional (3D), we have compared the numerical results for the different forms of the proposed mini-channels and the three different types of nano-fluids by using the Cu-water, the Ag-water, and the Diamond-water with a volume fraction of

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... %. The numerical results are obtained by choosing a Reynolds number (Re) between 100 and 900 and considering that the flow regime is stationary. The simulation was performed using commercial software, ANSYS-Fluent 15.0. The results obtained show that the increase of the exchange surface between the walls of the mini channels and the cooling fluid makes increases the heat exchange coefficient and the improvement of the maximum junction temperature of the electronic chip IGBT with the increase of the Reynolds number. The choice of nanoparticles has considerable effects on improving the heat transfer and the maximum junction temperature of the chip IGBT.