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Thermal monitoring has been broadly used to protect high-end integrated circuits from over-heating and to identify hot-spots in complex circuits. In this paper, we present a method to increase the sensitivity of an on-chip digital thermal sensor. In contrast to the existing mechanisms that characterize the overall temperature profile on a die, our solution is able to detect the submerged thermal variation caused by specific predefined events (SPE), under the precondition that the SPE's majordoi:10.1109/isvlsi.2009.31 dblp:conf/isvlsi/ChenNRS09 fatcat:lq2jgbj5ybapbm2s7jwf7rfiwq