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We present an approach to create ultrathin (<20 µm) and highly flexible crystalline silicon sheets on inexpensive substrates. We have demonstrated silicon sheets capable of bending radii as small as 2 mm without damaging the silicon structure. Using Microsystem tools, we created a suspended sub-millimeter honeycomb segmented silicon structure anchored to the wafer only by small tethers. This structure is created in a standard thickness wafer enabling compatibility with common tools. Thedoi:10.1109/jphotov.2011.2162973 fatcat:umjsvwa44bcuthwijjat3kjyta