Next-generation optoelectronic components enabled by direct-write microprinting technology

Donald J. Hayes, Ting Chen, Andrew R. Pirich, Michael J. Hayduk, Eric Donkor
2004 Enabling Photonic Technologies for Aerospace Applications VI  
Direct write microprinting technologies are now being developed and used across a wide spectrum of optoelectronic applications, because they provide opportunities for manufacturing a series of components in micrometer scales and in large array size with reduced cost. Micro-optic structures have been printed not only as stand-alone components, but also directly onto other active and passive components, such as VCSEL, photodiode, optical fiber, etc., to form high performance assemblies. These
more » ... semblies. These assemblies can be further integrated with electronic circuits via solder ball printing to construct miniature and high sensitivity sensing devices, such as photodiode array detector, fluorescence probe, etc. By implementing MEMS technologies, micro-clampers have also been developed for the alignment and packaging of miniature, multi-channel sensing devices.
doi:10.1117/12.541071 fatcat:vjt2jf65p5cbtkc4dqaz2moofq