Thinning and readout during bending of a custom silicon IC

Rune Langoy, Magnus Mager, Anh Tuan T. Nguyen, Jorgen A. Lien
2020 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)  
doi:10.1109/estc48849.2020.9229845 fatcat:46blequhmzhutd5nadzxcxdngi