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This paper introduces a set of analytical formulations for 3D modelling of inter-layer capacitances. Efficiency and accuracy are both guaranteed by the process characterization approach. Analytical modelling of interconnect capacitances is then demonstrated to be an helpful alternative to lookup tables or numerical simulations.doi:10.1109/date.1999.761185 dblp:conf/date/ToulouseBLN99 fatcat:7duyjizctfee5fohynzag5v27y