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Materials & design
Tin/Indium (Sn/In) nanosolder particles in the size range of 40-70 nm were successfully consolidated into nanosolder films by the ultrasonic power consolidation (UPC) method. The consolidated nanosolder film prevents the nanoparticles from oxidation, which is a common problem of nanomaterials during storage and processing, and makes the nanoparticles easier to handle. The quality of the consolidated nanosolders was examined by scanning electron microscopy (SEM),X-ray diffraction (XRD), anddoi:10.1016/j.matdes.2016.09.013 fatcat:etp5gopjuzf5pglgqfmhavj3dq