A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2021; you can also visit the original URL.
The file type is
Journal of The Japan Institute of Electronics Packaging
Currently, power electronics on both academic and industrial level is experiencing a major change in the essential building block of all power electronic systems, the actual semiconductor device. Whereas silicon (Si) based switches and diodes have dominated the research, development, and application from small discrete devices to large high-power modules since its beginning, in the recent years the market has seen a sharp rise in offerings using alternative, mainly wide bandgap materials suchdoi:10.5104/jiep.20.432 fatcat:d3xpxxqmzngqjjni62vt5tiagi