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Development of Boric Acid Free High Speed Electro Nickel Plating Bath
有機酸を用いたホウ酸フリー高速電気Niめっき浴の開発
2012
Journal of The Surface Finishing Society of Japan
有機酸を用いたホウ酸フリー高速電気Niめっき浴の開発
Preserved Fulltext
For the field of nickel electroforming, where thickness of about 100-500 μm is obtained at the current density of 20-50 A/dm 2 , increase in the current density is demanded for higher plating speed. Regarding the environmental impact, a plating bath without boric acid is also in demand. Results obtained from studying various organic acids to replace boric acid show that acetic acid facilitates high-speed plating without burning at a current density of up to 200 A/dm 2 . The effect of acetic
doi:10.4139/sfj.63.41
fatcat:krasv7rrbnahpg2a3zojrfrqry