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Multi-band RF and mm-wave design solutions for integrated RF functions in liquid crystal polymer system-on-package technology

V. Palazzari, D. Thompson, N. Papageorgiou, S. Pinel, J.H. Lee, S. Sarkar, R. Pratap, G. DeJean, R. Bairavasubramanian, R.-L. Li, M. Tentzeris, J. Laskar (+2 others)
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)  

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Electronic packaging evolution involves systems, technology and material considerations. In this paper, we present a liquid crystal polymer (LCP) based multilayer packaging technology that is rapidly emerging as an ideal platform for low cost, multi-band and reconfigurable RF front-end module integration. LCP's very low water absorption (0.04%), low cost and high electrical performance makes it very appealing for RF applications. Here we describe main characteristics and real performance of LCP
more » ... substrate, by means of several design examples. A Single-Input-Single-Output (SISO) dual-band filter operating at ISM 2.4-2.5 GHz and UNII 5.15-5.85 GHz frequency bands, a dual polarization, dual frequency 2x1 antenna operating at 14 and 35 GHz, and a WLAN IEEE 802.11a compliant compact module (volume of 75x35x0.2 mm 3 ) have been fabricated on LCP substrate, showing the great potential of the System-On-Package approach for 3D compact, multi-band and reconfigurable integrated RF and millimeter waves functions and modules.
doi:10.1109/ectc.2004.1320338 fatcat:cac23jzecnentlo33wzikepbha
Citation

V. Palazzari, D. Thompson, N. Papageorgiou, S. Pinel, J.H. Lee, S. Sarkar, R. Pratap, G. DeJean, R. Bairavasubramanian, R.-L. Li, M. Tentzeris, J. Laskar, J. Papapolymerou, L. Roselli. "Multi-band RF and mm-wave design solutions for integrated RF functions in liquid crystal polymer system-on-package technology." 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)