Combining High Resolution Pulsed TIVA and nanoprobing techniques to identify drive strength issues in mixed signal circuits

VK Ravikumar, MY Ho, RR Goruganthu, SL Phoa, V Narang, JM Chin
2010 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits  
This paper uses an interesting case study to highlight high-resolution pulsed thermal-induced voltage alteration (TIVA) with solid immersion lens (SIL) as a technique to isolate a temperature-sensitive failure in mixed-signal circuitry, followed by circuit analysis and nanoprobing to confirm a drive strength issue caused by a process change.
doi:10.1109/ipfa.2010.5531991 fatcat:zwahnem2j5hydbv7euto5k3lna