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Combining High Resolution Pulsed TIVA and nanoprobing techniques to identify drive strength issues in mixed signal circuits

VK Ravikumar, MY Ho, RR Goruganthu, SL Phoa, V Narang, JM Chin
2010 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits  

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This paper uses an interesting case study to highlight high-resolution pulsed thermal-induced voltage alteration (TIVA) with solid immersion lens (SIL) as a technique to isolate a temperature-sensitive failure in mixed-signal circuitry, followed by circuit analysis and nanoprobing to confirm a drive strength issue caused by a process change.
doi:10.1109/ipfa.2010.5531991 fatcat:zwahnem2j5hydbv7euto5k3lna
Citation

VK Ravikumar, MY Ho, RR Goruganthu, SL Phoa, V Narang, JM Chin. "Combining High Resolution Pulsed TIVA and nanoprobing techniques to identify drive strength issues in mixed signal circuits." 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (2010)