Thermal Analysis of Ultimately-Thinned-and-Transfer-Bonded CMOS on Mechanically Flexible Foils

Justine Philippe, Arun Bhaskar, Etienne Okada, Flavie Braud, Jean-Francois Robillard, Francois Danneville, Christine Raynaud, Daniel Gloria, Emmanuel Dubois
2019 IEEE Journal of the Electron Devices Society  
doi:10.1109/jeds.2019.2939884 fatcat:3bvynyo6djdjjfizdnup4rr3ra