Finite Element Thermal Analysis for Microscale Laser Joining of Glass/Silicon System

Ankitkumar Dhorajiya, Mohammed Mayeed, Golam Newaz
2010 51st AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference 18th AIAA/ASME/AHS Adaptive Structures Conference 12th   unpublished
Finite element thermal analysis and comparison with experiments of microscale laser joining of dissimilar materials, glass (Gl) and silicon (Si) is vital for the long-term application of opto-electronics. In this study, a comprehensive three dimensional (3D) transient simulation for thermal analysis of transmission laser micro-joining of dissimilar materials has been performed by using the finite element (FE) code ABAQUS, along with a moving super Gaussian laser heat source. The laser beam
more » ... The laser beam (wavelength of 808 nm and diameter of 0.8 mm), moving at velocities of 30 and 60 mm/min, passes through the transparent Gl, gets absorbed by the absorbing Si, and eventually softens/melts the Gl to form the bond. Computational results have been compared with experiments in terms of bond widths and a good comparison has been observed. Then the computational model has been used to optimize the process parameters like laser traveling velocity and dwell time at the start of laser travel. It has been observed that at a laser traveling velocity of 30 mm/min with an initial dwell time of above 3 seconds good bonding can be obtained with Gl melting all along the travel of laser beam.
doi:10.2514/6.2010-2819 fatcat:gmix5pzyzvfbfdlm6qgbl6gnvi