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In the world of semiconductor industry, automation plays a big role on every manufacturing plants to improve efficiency, prevent product yield losses, and making sure that top quality products will be delivered on end user. On die attach curing process of manufacturing semiconductor integrated circuits (IC) devices, certain problems occur like wrong Nitrogen (N2) parameter setting on the oven curing machine, with human intervention during setup, causing leadframe oxidation related defects. Thedoi:10.9734/jerr/2021/v20i417304 fatcat:7npvx3giwrfsparluzbnfvkzae