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CMOS IC Technology Scaling and Its Impact on Burn-In
2004
IEEE transactions on device and materials reliability
This article describes how CMOS IC technology scaling impacts semiconductor burn-in and burn-in procedures. Burn-in is a quality improvement procedure challenged by the high leakage currents that are rapidly increasing with IC technology scaling. These currents are expected to increase even more under the new burn-in environments leading to higher junction temperatures, possible thermal runaway, and yield loss of good parts during burn-in. The paper discusses the effect of junction temperature
doi:10.1109/tdmr.2004.826591
fatcat:v3acbhskxrawfcgeas5ru7t26m