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The formation of high-melting-point Cu6Sn5 interconnections is crucial to overcome the collapse of Sn-based micro-bumps and produce reliable intermetallic interconnections in three-dimensional (3D) package. However, because of the multiple reflows in 3D package manufacturing, Cu6Sn5 interconnections will experience the cyclic polymorphic transitions in the solid state. The repeated and abrupt change in the Cu6Sn5 lattice due to the cyclic polymorphic transitions can cause extreme straindoi:10.20944/preprints201911.0224.v1 fatcat:h5ajybuurzhida5ia7nbi63yy4