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In scanning electron microscope (SEM)-based integrated circuit (IC) failure analysis, there is often a need for manual location of a prespecified failure site in several ICs. Such a procedure is both tedious and time consuming. This paper presents a new vision-based die positioning system that can automatically locate a specified failure site without the need for a high-accuracy specimen stage. Depending on the appearance of the desired failure site, the system applies either image registrationdoi:10.1002/sca.4950240206 fatcat:hbyqxqxrt5eznbvra7w57yqfjy