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Novel First-Level Interconnect Techniques for Flip Chip on MEMS Devices
2012
Journal of microelectromechanical systems
Flip-chip packaging is desirable for microelectro-mechanical systems (MEMS) devices because it reduces the overall package size and allows scaling up the number of MEMS chips through 3-D stacks. In this report, we demonstrate three novel techniques to create first-level interconnect (FLI) on MEMS: 1) Dip and attach technology for Ag epoxy; 2) Dispense technology for solder paste; 3) Dispense, pull, and attach technology (DPAT) for solder paste. The above techniques required no additional
doi:10.1109/jmems.2011.2171326
pmid:24504168
pmcid:PMC3913265
fatcat:lhfej3pxp5hmfisovwhl4yfur4