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Study on electrical performance of metal copper films deposited by magnetron sputtering on polyimide flexible substrates
For preparing flexible copper clad laminate, copper films are deposited by magnetron sputtering on polyimide substrates. During the experiment, the prepared copper films show good conductivity while changing the technological parameter like preparation temperature, substrate bias, preparation time, and so on. The composition, structure, and surface morphology of the thin film are investigated by X-ray diffraction (XRD) and scanning electron microscope (SEM). The stylus profilometer anddoi:10.7498/aps.63.138101 fatcat:c5vsrk5cqvdynpipxbmv3yvvli