A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2017; you can also visit the original URL.
The file type is
Transducers '01 Eurosensors XV
This paper reports a new approach to the fabrication of 3D structured diaphragms using integrated surface and deep reactive ion etching (DRIE) bulk silicon micromachining on a silicon-on-insulator (SOI) wafer. The fabrication process has been applied to a 1 mm × 2 mm × 1.2 µm diaphragm designed for a biomimetic directional microphone. The membrane has two 200 µm × 380 µm × 20 µm silicon proof masses, solid stiffeners, and a 20 µm deep corrugation. Acoustic measurements of the diaphragm usingdoi:10.1007/978-3-642-59497-7_30 fatcat:ejrecx2jinenfpytybolmt3lyu