Effect Of Cw Laser Annealing On Silicon Surface For Application Of Power Device

Satoru Kaneko, Takeshi Ito, Kensuke Akiyama, Manabu Yasui, Chihiro Kato, Satomi Tanaka, Yasuo Hirabayashi, Takeshi Ozawa, Akira Matsuno, Takashi Nire, Hiroshi Funakubo, Mamoru Yoshimoto
2011 Zenodo  
As application of re-activation of backside on power device Insulated Gate Bipolar Transistor (IGBT), laser annealing was employed to irradiate amorphous silicon substrate, and resistivities were measured using four point probe measurement. For annealing the amorphous silicon two lasers were used at wavelength of visible green (532 nm) together with Infrared (793 nm). While the green laser efficiently increased temperature at top surface the Infrared laser reached more deep inside and was
more » ... ive for melting the top surface. A finite element method was employed to evaluate time dependent thermal distribution in silicon substrate.
doi:10.5281/zenodo.1080968 fatcat:ixjp6jf3qnhxhbsi27iyk2a6ba